FEA or CFD? Which tool do I need for a thermal physics problem?

Is Finite Element Analysis (FEA) or Computational Fluid Dynamics (CFD) the right simulation approach? Watch the video to see how the analysis tools compare when analyzing the same electrical thermal physics problem:

Thermal Analysis Provides Design Insights

Utilizing simulation tools should enable you to increase design efficiency and reduce the need for multiple prototypes.

SOLIDWORKS offers two options for thermal physics problem analysis: SOLIDWORKS Simulation, an FEA tool, and SOLIDWORKS Flow Simulation, a CFD tool.

How do you know which tool to select? Or a better question might be: Which technology provides more granular feedback regarding the physical forces on your product?

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